Illig: Sustainable all-cardboard blister pack at PackExpo 2021
News General news
At PackExpo Las Vegas, Nevada USA, from September 27 to 29, ILLIG will be demonstrating the production of sustainable, all-cardboard blisters from recycled materials with different designs and contents on a single packaging system.
At booth 5963 in the South Lower Hall at the Las Vegas Convention Center, ILLIG will be presenting the latest packaging system of the HSU 35b series. The system is suitable for safe and sustainable blister packaging made of cardboard-plastic cardboard combinations (double card blister) or solid cardboard for non-food products. The economical and efficient HSU 35b is designed for variable blister heights and can be configured with 3, 6, 8, 10, or 12 transport pallets for any application. The compact machine adapts to the individual requirements of packaging manufacturers with numerous equipment features. Examples include automatic product feeding, product presence control, product inlay, inserts for brochures, marking systems, code readers, and blister lifters. ILLIG packaging systems are modular, flexible, and efficient, allowing brand owners and co-packers the freedom to design sustainable packaging for a variety of end markets.